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印制電路板行業(yè)翻譯公司-PCB行業(yè)英文常用詞匯翻譯-上海譯境整理
發(fā)表時間:2015/05/30 00:00:00 來源:m.xiaoshizhe.com.cn 作者:m.xiaoshizhe.com.cn 瀏覽次數(shù):6912
| PCB常用英文詞匯匯編 | |||||||||
| A a | |||||||||
| A.O.I(Automatic Optical Inspection) | 自動光學(xué)檢查 | Apparatus | 設(shè)備，儀器 | ||||||
| Acceptable quality level (AQL) | 可接受質(zhì)量水平 | Area | 面積 | ||||||
| Accuracy | 精確度 | Artwork | 菲林 | ||||||
| Activating | 活化 | Artwork Drawing | 菲林圖形 | ||||||
| Active carbon treatment | 活性碳處理 | Artwork Film | 原裝菲林 | ||||||
| After Pressed Thickness | 壓板后之厚度 | Artwork Modification | 菲林修改 | ||||||
| Alignment | 校直，結(jié)盟 | Artwork No. | 菲林編號 | ||||||
| Annular ring | 錫圈 | Assembly | 組裝，裝配 | ||||||
| Anti-Static Bag | 靜電膠袋 | Axis | 軸 | ||||||
| B b | |||||||||
| Backplane | 背板 | Blistering | 起泡/水泡 | ||||||
| Back-up | 墊板 | Board Cutting | 開料 | ||||||
| Baking | 烘板 | Board Thickness | 板厚 | ||||||
| Ball Grid Array (BGA) | 球柵陣列 | Bottom side | 底層 | ||||||
| Bare board | 裸板 | Breakaway tab | 打斷點 | ||||||
| Base Copper | 底銅 | Brushing | 磨刷 | ||||||
| Base material | 基材 | Build-up | 積層 | ||||||
| Bevelling | 斜邊 | Bullet pad | 子彈盤 | ||||||
| Black Oxide | 黑氧化 | Buried hole | 埋孔 | ||||||
| Blind via hole | 盲孔 | ||||||||
| C c | |||||||||
| C/M(Component Marking) | 元件字符 | Conductor width/space | 導(dǎo)體線寬/線隙 | ||||||
| Carbon ink | 碳油 | Contact | 接點 | ||||||
| Carrier | 帶板 | Copper area | 銅面積 | ||||||
| Ceramic substrate | 陶瓷 | Copper clad | 銅箔 | ||||||
| Certificate of Compliance | 合格證書 | Copper foil | 銅箔 | ||||||
| Chamfer | 倒角 | Copper plating | 電鍍銅 | ||||||
| Chemical cleaning | 化學(xué)清洗 | Corner | 角線 | ||||||
| Chemical corrosion | 化學(xué)腐蝕 | Corner mark | 板角記號 | ||||||
| Chip Scale Package (CSP) | 晶片比例包裝 | Corner REG.Hole | 角位對位孔 | ||||||
| Circuit | 線路 | Cracking | 裂縫 | ||||||
| Clearance | 間距/間隙 | Creasing | 皺折 | ||||||
| Color | 顏色 | Criteria | 規(guī)格,標(biāo)準(zhǔn) | ||||||
| Component Side(C/S) | 元件面 | Crossection area | 切面 | ||||||
| Composite layers | 復(fù)合層 | Cu/Sn Plating | 鍍銅錫 | ||||||
| Computer Aided Design (CAD) | 電腦輔助設(shè)計 | Current efficiency | 電流效率 | ||||||
| Computer Aided Manufacturing (CAM) | 電腦輔助制作 | Customer | 客戶 | ||||||
| Computer Numerial Control (CNC) | 數(shù)控 | Customer Drilling File | 客戶鉆孔資料 | ||||||
| Conductor | 導(dǎo)體 | Customer P/N | 客戶產(chǎn)品編號 | ||||||
| D d | |||||||||
| D/F Registration Hole | 干菲林對位孔 | Diamond | 鉆石 | ||||||
| D/F(Dry Film) | 干膜 | Diazo film | 重氮片 | ||||||
| Date Code | 日期代號 | Dielectric breakdown | 介電擊穿 | ||||||
| Datum hole | 基準(zhǔn)參考孔 | Dielectric constant | 介電常數(shù) | ||||||
| Daughter board | 子板 | Dielectric Thickness | 介電層厚度 | ||||||
| Deburring | 去毛刺 | Dielectric Voltage Test | 絕緣測試 | ||||||
| Defect | 缺陷 | Dimension | 尺寸 | ||||||
| Definition | 定義 | Dimensional stability | 尺寸穩(wěn)定性 | ||||||
| Delamination | 分層 | Direct/indirect | 直接/間接 | ||||||
| Delay | 耽擱 | Distribution | 發(fā)放 | ||||||
| Delivery | 交貨 | Document type | 文件種類 | ||||||
| Densitomefer | 透光度計 | Documentation Control | 文件控制 | ||||||
| Density | 密度 | Double sided board | 雙面板 | ||||||
| Department | 部門 | Drill bit | 鉆咀 | ||||||
| Description | 說明 | Drilling | 鉆孔 | ||||||
| Design origin | 設(shè)計原點 | Drilling Roughness | 鉆孔粗糙度 | ||||||
| Desmear | 去鉆污,除膠 | Dry Film | 干菲林 | ||||||
| Dessicant | 防潮珠 | Dry Film-Pattern | 干膜線路 | ||||||
| Developer | 顯影液,顯影機 | Dynamic | 動態(tài) | ||||||
| E e | |||||||||
| ECN(Engineering Change Notification) | 工程更改通知 | Entek | 有機涂覆 | ||||||
| Effective date | 有效期 | Epoxy glass substrate | 環(huán)氧玻璃基板 | ||||||
| Electrical Test Fixture | 電測試 針床 | Epoxy resin | 環(huán)氧基樹脂 | ||||||
| Electro migration | 漏電 | Etch | 蝕刻 | ||||||
| Electroconductive paste | 導(dǎo)電膠 | Etchback | 凹蝕 | ||||||
| Electroless | 無電沉 | Etching | 蝕刻 | ||||||
| Electroless copper | 無電沉銅 | E-Test Marking | 電測試標(biāo)記 | ||||||
| Electroless Ni | 無電沉鎳 | E-Test(Electrical Test) | 電測試 | ||||||
| Electroless Gold/Au | 無電沉金 | Exposure | 曝光 | ||||||
| Engineering drawing | 工程圖紙 | External layer | 外層 | ||||||
| F f | |||||||||
| Fiducial mark | 基準(zhǔn)點 | Fixture | 夾具 | ||||||
| Filling | 填充 | Flammability | 可燃性 | ||||||
| Film Fabrication | 菲林制作 | Flash Gold | 薄金 | ||||||
| Final QC | 最終檢查 | Flexible | 易曲的,能變形的 | ||||||
| Finish Overall Board Thickness | 成品總板厚度 | Flux | 助焊劑 | ||||||
| G g | |||||||||
| General information | 一般資料 | Golden board | 金板 | ||||||
| Ghost image | 重影 | Grid | 網(wǎng)格 | ||||||
| Glass transition temperature | 玻璃化濕度 | Ground plane | 地線層 | ||||||
| Gold Finger(G/F) | 金手指 | ||||||||
| H h | |||||||||
| HAL(Hot Air Leveling) | 熱風(fēng)整平 | Hole density | 孔的密度 | ||||||
| Hand Rout | 手鑼 | Hole Diameter | 孔徑 | ||||||
| Hardness | 硬度 | Hole location | 孔位 | ||||||
| Heat Sealed | 熱密封 | Hole Location Chart | 孔位座標(biāo)表 | ||||||
| Heat Shrink-warp | 熱收縮 | Hole Position Tolerance | 孔位誤差 | ||||||
| Holding time | 停留時間 | Hole size | 孔尺寸 | ||||||
| Hole | 孔 | Hot Air Leveling(HAL) | 熱風(fēng)整平 | ||||||
| Hole breakout | 破環(huán) | Humidity | 濕度 | ||||||
| I | |||||||||
| Identification | 標(biāo)識,指標(biāo) | Inter Plane Separation | 內(nèi)層分離 | ||||||
| Image | 影像 | Interleave Paper | 隔紙 | ||||||
| Imaging transfer | 圖形轉(zhuǎn)移 | Internal layer | 內(nèi)層 | ||||||
| Impedance | 阻抗 | Internal stress | 內(nèi)應(yīng)力 | ||||||
| Impedance Test | 阻抗測試 | Ionic cleanliness | 離子清潔度 | ||||||
| Inner copper foil | 內(nèi)層銅箔 | Isolation | 孤立 | ||||||
| Inspection | 檢驗 | Isolation Resistance | 絕緣電阻 | ||||||
| Insulation resistance Test | 絕緣測試 | Item | 項目 | ||||||
| K k | |||||||||
| KEY board | 按鍵盤 | Kraft paper | 牛皮紙 | ||||||
| Key slot | 槽孔 | ||||||||
| L l | |||||||||
| Laminate | 板材 | Legend Width | 字符寬度 | ||||||
| Laminate Thickness | 材料厚度 | Length | 長度 | ||||||
| Lamination void | 層間空洞 | Lifted Lands | 殘銅 | ||||||
| Landless hole | 破孔 | Line Width | 線寬 | ||||||
| Laser plotter | 激光繪圖機 | Liquid | 液體 | ||||||
| Laser plotting | 激光繪圖 | Location | 位置 | ||||||
| Laser via hole | 激光穿孔 | Logic diagram | 邏輯圖形 | ||||||
| Layup | 層壓配本 | Logo | 嘜頭,標(biāo)記 | ||||||
| Lay-up Instruction | 壓板指示 | Lot size | 批卡 | ||||||
| Legend | 字符 | ||||||||
| M m | |||||||||
| Mark | 標(biāo)記 | Min. Nickel Thickness | 最小鎳厚 | ||||||
| Master drawing | 菲林圖形 | Min. Tin-Lead Thickness (After HAL) | （噴錫后）最小錫厚 | ||||||
| Material Thickness | 材料厚度 | Min.Annular Ring | 最小環(huán)寬 | ||||||
| Material Type | 材料類型 | Min.Spacing between Line to Line | 線與線之間的最小距離 | ||||||
| Max. X-out | 壞板上限 | Min.Spacing between Line to Pad | 線與焊盤之間的最小距離 | ||||||
| Max.Board Thickness After Plating | 電鍍后總板厚度之上限 | Min.Spacing between Pad to Pad | 焊盤與焊盤之間的最小距離 | ||||||
| Measling | 白斑 | Minimum | 最小 | ||||||
| Mech Drawing No. | 圖紙編號 | Mirroring | 鏡像 | ||||||
| Mechanical cleaning | 機械清洗 | Missing | 缺少 | ||||||
| Metal | 金屬 | Model No. | 產(chǎn)品名稱 | ||||||
| Method | 方法 | Molded | 模塑 | ||||||
| MI(Manufacturing Instruction) | 生產(chǎn)制作指示 | Mother board | 主板 | ||||||
| Microstrip | 微條線 | Moulding | 模房 | ||||||
| Min Conductor Copper Thickness | 最小線路銅厚 | Mounting hole | 安裝孔 | ||||||
| Min Hole Wall Copper Thickness | 最小孔壁銅厚 | Multilayer | 多層板 | ||||||
| Min. Gold Plating Thickness | 最小金厚 | Multi-layer Laminate | 多層板材料 | ||||||
| N n | |||||||||
| Negative | 反面的 | No.of Panel per Stack | 每疊板數(shù) | ||||||
| Net list | 網(wǎng)絡(luò)表 | No.of Panel/Sheet | 每張大料拼板數(shù) | ||||||
| Network | 網(wǎng)絡(luò) | No.of Pcs Per Bag | 每包數(shù)量 | ||||||
| Nick | 缺口 | No.of Unit/Array | 每套單元數(shù) | ||||||
| No. of holes | 孔數(shù) | Normal value | 標(biāo)準(zhǔn)值 | ||||||
| No.of Array/Panel | 每個拼板套板數(shù) | ||||||||
| O o | |||||||||
| Oblong | 橢圓形的 | Organic Solerability Peservatives(OSP) | 有機保護劑 | ||||||
| Offset | 偏移 | Originator | 原作者 | ||||||
| Open/short | 開路/短路 | Outer copper foil | 外層銅箔 | ||||||
| Optimization(design) | 最佳化(設(shè)計) | Outline | 外形 | ||||||
| P p | |||||||||
| Packing | 包裝 | Pitch | 間距 | ||||||
| Packing | 包裝 | Placement | 放置 | ||||||
| Pad | 焊盤 | Plated Though Hole(PTH) | 沉銅 | ||||||
| Panel Area | 拼板面積 | Plating | 電鍍 | ||||||
| Panel Plated Crack | 板鍍?nèi)笨? | Plating Crack | 電鍍裂縫 | ||||||
| Panel plating | 整板電鍍 | Plating line | 電鍍線 | ||||||
| Panel Size | 拼板尺寸 | Plating rack | 電鍍架 | ||||||
| Panel Size After Outerlayer Cutting | 外層切板后拼板尺寸 | Plating Void | 電鍍針孔 | ||||||
| Panel Utilization | 拼板利用率 | Plug Hole | 塞孔 | ||||||
| Pass rate | 通過率 | Polymer | 聚合體 | ||||||
| Passivation | 鈍化 | Porosity | 孔隙率 | ||||||
| Pattern | 線路 | Positive | 絕對的 | ||||||
| Pattern Inspection | 線路檢查 | Power plane | 電源層 | ||||||
| Pattern plating | 圖形電鍍 | Prepreg | 半固化片 | ||||||
| PCB(Printed Circuit Board) | 印制線路板 | Primary side | 首面 | ||||||
| Peck drilling | 啄鉆 | 印刷 | |||||||
| Peel strength | 剝離強度 | Probe point | 針床測點 | ||||||
| Peelable | 可剝性 | Process | 工序 | ||||||
| Peelable | 剝離強度 | Process flow | 工序流程 | ||||||
| Peelable Mask | 可脫油 | Product Planning Dept. | 生產(chǎn)計劃部 | ||||||
| Peeling | 剝離 | Production | 生產(chǎn)板 | ||||||
| Permanent | 永久性 | Profile | 外形 | ||||||
| PH value | PH值 | Profiling | 外形加工 | ||||||
| Photo plotting | 圖形輸出 | Profiling Process | 外形加工 | ||||||
| Photo via hole | 菲林過孔 | Project No. | 產(chǎn)品編號 | ||||||
| Photographers | 照片靶標(biāo) | PTH Thermal Seress Test | PTH熱沖擊測試 | ||||||
| Photoplotler | 光繪機 | PTH(Plating Through Hole) | 沉銅 | ||||||
| Physical | 物理的 | Pull away | 拉離 | ||||||
| Pin hole | 銷定孔 | Punch | 啤模 | ||||||
| Pink ring | 粉紅環(huán) | Punching | 沖切 | ||||||
| Pinning hole | 鉆孔管位 | Punching Mould Drawing | 啤模圖形 | ||||||
| Q q | |||||||||
| QA Audit | 品質(zhì)審計 | Quality | 質(zhì)量 | ||||||
| QA(Quanlity Assurance) | 品質(zhì)部 | Quantity | 數(shù)量 | ||||||
| Quad Palt Pack (QFP) | 四邊扁平林整器件 | ||||||||
| R r | |||||||||
| Raw Material Utilization | 原材料利用率 | Resist | 抗蝕劑 | ||||||
| Recall | 回收 | Resolution | 分辨率 | ||||||
| Rectifier | 整流器 | Rigid | 精密的 | ||||||
| Register mark | 對位點 | Roller coating | 涂覆 | ||||||
| Registration | 重合點 | Roughening | 粗化 | ||||||
| Remark | 備注 | Round pad | 圓盤 | ||||||
| Resin | 樹脂 | Routing | 外形加工,銑板 | ||||||
| Resin Recession | 流膠 | ||||||||
| S s | |||||||||
| S/M Material | 綠油物料 | Solder mask on bare copper (smobc) | 裸銅覆蓋阻焊膜 | ||||||
| S/M(Solder Mask) | 阻焊 | Solder side | 焊接面 | ||||||
| Sales | 銷售 | Solder Side C/M | 阻焊面字符 | ||||||
| Sample | 樣板 | Solder Side Cir. | 焊接面線路 | ||||||
| Sampling inspection | 抽樣檢驗 | Solder Side Circuit | 焊接面 | ||||||
| Scaling factor | 縮放比例因素 | Solder Side S/M | 焊接面阻焊 | ||||||
| Scope | 范圍 | Solderability | 可焊性 | ||||||
| Scoring | 刻槽 | Solvent Test | 可溶性測試 | ||||||
| Scratch | 劃痕 | Spacing | 線距 | ||||||
| Secondary side | 第二面 | Special requirement | 特殊要求 | ||||||
| Section Code | 組別代號 | Specification | 詳細說明，規(guī)范 | ||||||
| Section Code Change | 組別代號更改 | Spindle | 主軸 | ||||||
| Segment | 部分,片段 | Split | 裂片 | ||||||
| Separated | 分離 | Square pad | 方塊 | ||||||
| Sequence | 順序 | Standard | 標(biāo)準(zhǔn)值 | ||||||
| Sets | 套 | Static | 靜態(tài) | ||||||
| Sheet Size | 大料尺寸 | Stencial | 網(wǎng)版 | ||||||
| Shematic diagram | 原理圖 | Step drilling | 分布鉆 | ||||||
| Shiny | 有光澤的,發(fā)光的 | Step scale | 光梯尺 | ||||||
| Silk screen | 絲印 | Store | 貨倉 | ||||||
| Silver film | 銀鹽片 | Supplier | 供應(yīng)商 | ||||||
| Single/double | 單層/雙面 | Supported hole | 支撐點 | ||||||
| Slot | 槽,坑 | Surface | 表面 | ||||||
| Smear | 污點 | Surface mount technology | 表面組裝技術(shù) | ||||||
| Solder Mask | 阻焊 | Swimming | 滑移 | ||||||
| T t | |||||||||
| Tack | 堆起 | Thermal stress | 熱應(yīng)力 | ||||||
| Tape Programming | 鉻帶制作 | Thickness | 厚度 | ||||||
| Tape Test | 膠帶測試 | Tin Content | 錫含量 | ||||||
| Target Hole | 目標(biāo)孔 | Tin/Lead Stripping | 退鉛錫 | ||||||
| Teardrop | 淚珠 | Tin-lead plating | 電鍍鉛錫 | ||||||
| Template | 天平 | Tolerance | 公差 | ||||||
| Tenting | 封孔 | Top side | 板面 | ||||||
| Test | 測試 | Touch up | 修理(執(zhí)漏) | ||||||
| Test coupon | 圖樣 | Training | 訓(xùn)練 | ||||||
| Test Parameter | 測試參數(shù) | Transmission | 傳輸線 | ||||||
| Test Pattern | 測試孔 | Transmittance | 傳送 | ||||||
| Testing Voltage | 電壓 | Trim line | 修剪 | ||||||
| Thermal shock | 熱沖擊 | ||||||||
| U u | |||||||||
| Ultrasonic cleaning | 超聲波清洗 | Unit Layout Per Panel | 單元拼板圖 | ||||||
| Undercut | 側(cè)蝕 | Uv-blocking | 阻擋紫外線 | ||||||
| Unit Arrangement | 單元排版 | ||||||||
| V v | |||||||||
| Vacunm Pack | 真空包裝 | Visual & Warpage | 可視性和翹曲度 | ||||||
| Vacuum lamination | 真空壓制 | Visual inspection | 目檢 | ||||||
| V-Cut | V- 坑 | Voltage | 電壓 | ||||||
| View From… | 觀察方向由… | ||||||||
| W w | |||||||||
| W/F(Wet Film) | 濕膜 | Width | 寬度 | ||||||
| Warp & Twist | 翹曲和彎曲 | Wiring | 線路 | ||||||
